충남대학교 외국학술지지원센터

글로벌메뉴

검색어[키워드 / 전체:Journal]

총 479건 중 479건 출력

3/48 페이지

검색리스트 테이블
No	서명	저자	발행처	원문제공시작년
21	REVIEW OF THE JOURNAL LITERATURE - Earth sciences/		American Society of Mechanical Engineers]	2000

22	Fatigue Life Analysis of Solder Joints in Flip Chip Bonding/	Tsukada, Yutaka	American Society of Mechanical Engineers	2000

23	Tools for Stress Analysis of Microelectronic Structures/	Mirman, Boris	American Society of Mechanical Engineers	2000

24	Combining Leakage and Orifice Flows in a Hydraulic Servovalve Model/	Eryilmaz, Bora	American Society of Mechanical Engineers	2000

25	A Study of Process-Induced Residual Stress in PBGA Packages/	Wu, Zhu	American Society of Mechanical Engineers	2000

26	Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria/	Mirman, Boris	American Society of Mechanical Engineers	2000

27	A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints/	Zhang, Xiaowu	American Society of Mechanical Engineers	2000

28	Reliability Analysis of Flip Chip Designs Via Computer Simulation/	Lu, Hua	American Society of Mechanical Engineers	2000

29	CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis	Pang, John H L	American Society of Mechanical Engineers	2000

30	The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel/	Cui, C	American Society of Mechanical Engineers	2000

1 2 3 4 5 6 7 8 9 10

임시보관함보기