충남대학교 외국학술지지원센터

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Procedures for Metallographic Examination and Mechanical Strength Testing of Fine Pitch Surface Mount IC Package Solder Joints

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자료유형	학술지논문
논문명	Procedures for Metallographic Examination and Mechanical Strength Testing of Fine Pitch Surface Mount IC Package Solder Joints
저자명	Yamada, T.
학술지명	SOLDERING AND SURFACE MOUNT TECHNOLOGY
ISSN	0954-0911
발행년도	1995
권호사항	no.19
발행처	WELA PUBLICATIONS LTD
페이지	26