91 |
|
Applications of a Decomposed Analysis Procedure for Area-Array Packages/
|
Thompson, Terrace B
|
American Society of Mechanical Engineers
|
2001
|
|
|
92 |
|
Evaluation of the Moisture Sensitivity of Molding Compounds of IC's Packages/
|
Fr�mont, H
|
American Society of Mechanical Engineers
|
2001
|
|
|
93 |
|
Moisture Diffusion in Epoxy Molding Compounds Filled With Particles/
|
Uschitsky, M
|
American Society of Mechanical Engineers
|
2001
|
|
|
94 |
|
Forced Convection Board Level Thermal Design Methodology for Electronic Systems/
|
Cole, Reena
|
American Society of Mechanical Engineers
|
2001
|
|
|
95 |
|
Effect of Loading Rate on Fracture Morphology in a High Strength Ductile Steel
|
Venkert, A
|
American Society of Mechanical Engineers
|
2001
|
|
|
96 |
|
Off-Axis Torsion Tests on Tubular Specimens of Steel
|
Takeda, Takenobu
|
American Society of Mechanical Engineers
|
2001
|
|
|
97 |
|
Mechanics and Physics of Brittle to Ductile Transitions in Fracture
|
Argon, A S
|
American Society of Mechanical Engineers
|
2001
|
|
|
98 |
|
A General Time Dependent Constitutive Model: Part I- Theoretical Developments
|
Saleeb, A F
|
American Society of Mechanical Engineers
|
2001
|
|
|
99 |
|
Wire Coating Under Vacuum
|
Hade, Aaron J
|
American Society of Mechanical Engineers
|
2001
|
|
|
100 |
|
Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging/
|
Desai, Chandra S
|
American Society of Mechanical Engineers
|
2001
|
|
|