충남대학교 외국학술지지원센터

1.

서명: IEEE transactions on components and packaging technologies:a publication of the IEEE Components, Packaging, and Manufacturing Technology Society
저자: Institute of Electrical and Electronics Engineers Components, Packaging & Manufacturing Technology Society
발행처: Institute of Electrical and Electronics Engineers
원문제공시작년: 1999-
자료유형: 연속간행물 원문복사 신청
원문제공마감년

2.

서명: IEEE transactions on advanced packaging:a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society
저자: Components, Packaging & Manufacturing Technology Society Lasers and Electro-Optics Society (Institute of Electrical and Electronics Engineers) Insti
발행처: Institute of Electrical and Electronics Engineers
원문제공시작년: 1999-
자료유형: 연속간행물 원문복사 신청
원문제공마감년

3.

서명: IEEE transactions on components, packaging, and manufacturing technology:a publication of the IEEE Components, Packaging, and Manufacturing Technology Society ; IEEE TAB Steering Committee on Design and Manufacturing Engineering.Part C,Manufacturing
저자: Institute of Electrical and Electronics Engineers Components, Packaging & Manufacturing Technology Society IEEE TAB Steering Committee on Design and
발행처: Institute of Electrical and Electronics Engineers, Inc.
원문제공시작년: 1996-1998
자료유형: 연속간행물 원문복사 신청
원문제공마감년

4.

서명: IEEE transactions on components, packaging, and manufacturing technology:a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the IEEE Lasers and Electro-Optics Society.Part B,Advanced packaging
저자: Institute of Electrical and Electronics Engineers Lasers and Electro-Optics Society (Institute of Electrical and Electronics Engineers) Components,
발행처: Institute of Electrical and Electronics Engineers
원문제공시작년: 1994-
자료유형: 연속간행물 원문복사 신청
원문제공마감년

5.

서명: IEEE transactions on components, packaging, and manufacturing technology:a publication of the IEEE Components, Packaging, and Manufacturing Technology Society.Part A
저자: Institute of Electrical and Electronics Engineers Components, Packaging & Manufacturing Technology Society
발행처: Institute of Electrical and Electronics Engineers
원문제공시작년: 1994-
자료유형: 연속간행물 원문복사 신청
원문제공마감년

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