| 161 |
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F/9 Process Stability in the Tube Hydroforming Process/
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Groche, P
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Technische Rundschau
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2003
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| 162 |
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Feedback of manufacturing experience for DFM design rules
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Barton, R
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Technische Rundschau
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1996
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| 163 |
|
Friction studies in sheet metal forming based on a unique die shoulder force transducer
|
Weinmann, K. J
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Technische Rundschau
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1996
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| 164 |
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Function-oriented lapping and polishing of ceramic rolling elements through characterization of the workpiece surface
|
Westkaemper, E
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Technische Rundschau
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1996
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| 165 |
|
Fundamentals on the manufacturing of sheet metal micro parts
|
Geiger, M
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Technische Rundschau
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1996
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| 166 |
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G/1 Chip Formation Mechanisms in Grinding at Low Speeds/
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Brinksmeier, E
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Technische Rundschau
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2003
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| 167 |
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G/1 Temperatures in high efficiency deep grinding (HEDG)/
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Rowe, W B
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Technische Rundschau
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2001
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| 168 |
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G/2 An investigation of the effect of machine loop stiffness on grinding of ceramics/
|
Zhang, B
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Technische Rundschau
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2001
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| 169 |
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G/2 Optimization of Continuous Dress Creep-Feed Form Grinding Process/
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Guo, C
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Technische Rundschau
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2003
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| 170 |
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G/3 Dynamic behaviour of cylindrical traverse grinding processes/
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Weck, M
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Technische Rundschau
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2001
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| 171 |
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G/3 Temperatures in grinding of magnetic composites-theoretical and experimental approach/
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Kruszynski, B. W
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Technische Rundschau
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2003
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| 172 |
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G/4 An Investigation of Grinding with Electroplated CBN Wheels/
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Shi, Z
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Technische Rundschau
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2003
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| 173 |
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G/4 Application of AE contact sensing in reliable grinding monitoring/
|
Gomes de Oliveira, J F
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Technische Rundschau
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2001
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| 174 |
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G/5 Surface generation with engineered diamond grinding wheels: Insights from simulation/
|
Koshy, P
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Technische Rundschau
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2003
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| 175 |
|
G/5 Ultraprecision micro-grinding of germanium immersion grating element for mid-infrared super dispersion spectrograph/
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Ohmori, H
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Technische Rundschau
|
2001
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| 176 |
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G/6 Development of a superabrasive grinding wheel with defined grain structure using kinematic simulation/
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Aurich, J. C
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Technische Rundschau
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2003
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| 177 |
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G/6 Development of single step grinding system for large scale 300 mm si wafer: a total integrated fixed-abrasive solution/
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Eda, H
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Technische Rundschau
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2001
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| 178 |
|
G/7 Development of a High-Speed Manufacturing Method for Electroplated Diamond Wire Tool/
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Chiba, Y
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Technische Rundschau
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2003
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| 179 |
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G/7 Process analysis for the evaluation of the surface formation and removal rate in lapping/
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Heise, U
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Technische Rundschau
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2001
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| 180 |
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G/8 Lapping of single crystal diamond tools/
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Yuan, Z. J
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Technische Rundschau
|
2003
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