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유형		 서명 저자 발행처 원문제공시작년 수록
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1 저널기사 A Comparative Study on Methods for Cleaning and Preparation of the Board Surface with a Suspension of Abrasives in the Production of Fine Line Printed Circuits 미리보기
Aiassa, U. WELA PUBLICATIONS LTD 1994
2 저널기사 A Cost-effective High Efficiency LED Array Assembly Using Insulated Metal Substrates and Low Thermal Impedance SM Diode Encapsulation 미리보기
Sawa, H. WELA PUBLICATIONS LTD 1994
3 저널기사 A Heuristic Approach to Placement Sequences Identification for SMT 미리보기
Shih, W. WELA PUBLICATIONS LTD 1993
4 저널기사 A Large Format Modified TEA CO~2 Laser Based Process for Cost-effective Small Via Generation 미리보기
Morrison, J. M. WELA PUBLICATIONS LTD 1994
5 저널기사 Alloy 42 - A Material to be Avoided for Surface Mount Component Leads and Lead Frames 미리보기
Engelmaier, W. WELA PUBLICATIONS LTD 1995
6 저널기사 Alternative Solders for Electronics Assemblies. Part 2: UK Progress and Preliminary Trials 미리보기
Vincent, J. H. WELA PUBLICATIONS LTD 1993
7 저널기사 A Model of the Solder Flux Reaction; Reactions at the Metal/Metal Oxide/Electrolyte Solution Interface 미리보기
Nasta, M. WELA PUBLICATIONS LTD 1995
8 저널기사 A Model Study of Low Residue No-clean Solder Paste 미리보기
Jaeger, P. A. WELA PUBLICATIONS LTD 1993
9 저널기사 An Assessment of Cleaning Options for Soldered Electronic Assemblies (Phase II) 미리보기
Richards, B. P. WELA PUBLICATIONS LTD 1993
10 저널기사 An Assessment of the Use of Lead in Electronics Assembly 미리보기
Allenby, B. R. et al WELA PUBLICATIONS LTD 1993
11 저널기사 A Newly Developed System for Small Annular Ring Formation 미리보기
Masaoka, K. WELA PUBLICATIONS LTD 1995
12 저널기사 A New Strategy in the Recycling of Printed Circuit Boards 미리보기
Legarth, J. B. WELA PUBLICATIONS LTD 1995
13 저널기사 Anisotropic Conducting Adhesives for Electronic Interconnection 미리보기
Williams, D. J. WELA PUBLICATIONS LTD 1993
14 저널기사 A Novel Composite Material for Electronic Packaging 미리보기
Ting, J.-M. WELA PUBLICATIONS LTD 1995
15 저널기사 A Photoimageable Dielectric for Sequential PWB Fabrication 미리보기
Knudsen, P. D. WELA PUBLICATIONS LTD 1995
16 저널기사 A Physics-of-failure Design Philosophy Applied to Flip-chip Bonds 미리보기
Pusarla, C. WELA PUBLICATIONS LTD 1995
17 저널기사 Application Model for Organic Solderability Preservatives 미리보기
Wenger, G. M. WELA PUBLICATIONS LTD 1995
18 저널기사 Application of Diamond in Power Device Modules 미리보기
Fiegl, B. WELA PUBLICATIONS LTD 1994
19 저널기사 A Practical Solution for Low-cost, High Performance MCMs 미리보기
Hammond, J. WELA PUBLICATIONS LTD 1993
20 저널기사 A Reliability Study of Fuzz Button Interconnects 미리보기
Harris, D. B. WELA PUBLICATIONS LTD 1995
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