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제한항목: Chapman and Hall

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자료유형
- 기사 (278)
저자
- Hill, R G Fennell, B (3)
- Bhattacharya, A. K (2)
- Chrysostomou, A (2)
- Gale, W. F (2)
- Hull, D (2)
- 더보기(20)
- more...더보기 취소
출판사
- Chapman and Hall (278)
발행년도
- 2001 (64)
- 2003 (62)
- 1996 (61)
- 1997 (54)
- 2000 (29)
- 더보기(3)
- 더보기 취소

No	서명	저자	발행처	원문제공시작년
181	Interfacial reaction and adhesion between SiC and thin sputtered nickel films	Lim, C. S. Naoumidis, A. Gyarmati, E. Nickel, H.	Chapman and Hall	1997

182	Interfacial reactions and intermetallic compound growth between indium and copper/	Kim, D. G	Chapman and Hall	2004

183	Interfacial reactions between aluminum nitride reinforcement particles and aluminum alloys in AI-AIN metal matrix composites/	Ch�dru, M Chermant, J L; Vicens, J	Chapman and Hall	2001

184	Interfacial structure and reaction mechanism of AlN/Ti joints	El-Sayed, M. H	Chapman and Hall	1997

185	Interfacial structures and mechanical properties of steel-Ni and steel-Ti diffusion bonds	Abe, S. Tomizawa, T. Kato, H.	Chapman and Hall	1997

186	Interfacial toughness of diamond-like nanocomposite (DLN) thin films on silicon nitride substrates/	Pandit, A. Padture, N. P.	Chapman and Hall	2003

187	Interlaminar fracture toughness and associated fracture behaviour of bead-filled epoxy/glass fibre hybrid composites	Jung Ju Lee	Chapman and Hall	1995

188	Interlayer couplings and magnetoresistance effects of Fe/Cr/Fe/Ni-Fe/NiOsandwiches	Nakatani, R	Chapman and Hall	1997

189	Interleukin-6 expression by cultured human endothelial cells in contact with carbon coated polyethylene terephthalate/	Cenni, E	Chapman and Hall	2001

190	Intermediate annealing of pure aluminum during cyclic equal channel angular pressings/	Chang, J. Y. Shan, A.	Chapman and Hall	2003

191	Intermetallic compound layer formation between Sn-3.5 mass %Ag BGA solder ball and (Cu, immersion Au/electroless Ni-P/Cu) substrate/	Lee, C. B	Chapman and Hall	2003

192	Interpenetrating polymer networks of polyurethane cross-linked epoxy andpolyurethanes	Chern, Y. C	Chapman and Hall	1997

193	Interpretation of climatic temperature variations for accelerated ageing models/	Purnell, P	Chapman and Hall	2003

194	Interrelation between energy partitioned work of fracture parameters and the crack tip opening displacement in amorphous polyester films/	Karger-Kocsis, J; Moskala, E J Mouzakis, D E	Chapman and Hall	2000

195	Intralayer reorganization of photochromic molecular films/	Tsukruk, V V Larson, K; Li, S; Luzinov, I; Mcgrath, D V	Chapman and Hall	2001

196	Intraparticle structures of composite TiO2/SiO2 nanoparticles prepared by varying precursor mixing modes in vapor phase/	Cho, W. H. Kim, S. G. Kang, D. J.;	Chapman and Hall	2003

197	Investigating the influence of fabrication process and crystal orientation on shear strength of silicon microcomponents/	Yao, Da-Jeng; Carman, G P Kim, Chang-Jin; Chen, Quanfang	Chapman and Hall	2000

198	Investigation into the dielectric behavior of ferroelectric superlattices formed by pulsed laser deposition/	O'Neill, D	Chapman and Hall	2000

199	Investigation into the growth and electromechanical properties of \hbox{Pb}\hbox{(Mg}{1/3}\hbox{Nb}{2/3}\hbox{)O}{3} thin films/	Bowman, R M	Chapman and Hall	2000

200	Investigation of debonding processes in particle-filled polymer materials by acoustic emission: Part I Acoustic emission and debonding stress	Kraus, R. Wilke, W. Luzinov, I. Zhuk, A.	Chapman and Hall	1997

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