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검색리스트 테이블
No	서명	저자	발행처	원문제공시작년
1	Important Issues in Reflow Soldering	De Klein, F. J.	WELA PUBLICATIONS LTD	1994

2	Industrial Qualification of a No-clean Solder Cream	Mantrant-Le Bot, A.	WELA PUBLICATIONS LTD	1993

3	Initial and Ongoing Training Requirements	Boswell, D.	WELA PUBLICATIONS LTD	1995

4	Innovations in Organics Circuit Packaging Technology	Brauer, J. M.	WELA PUBLICATIONS LTD	1994

5	Integration of Thin Film Polyimide with PCB Technology	Kersten, P.	WELA PUBLICATIONS LTD	1993

6	Interferometric Micropositioning in the Planar Chip Insertion Technique for Multichip Modules (MCMs)	Vareille, A.	WELA PUBLICATIONS LTD	1995

7	Ionograph Sensitivity to Chemical Residues from `No Clean' Soldering Fluxes: Comparison of Solvent Extract Conductivity and Surface Conductivity	Adams, K. M.	WELA PUBLICATIONS LTD	1994

8	The Impact of Boundary scan on Surface Mount Technology in Design, Manufacturing and System Test	Adams, R.	WELA PUBLICATIONS LTD	1995

9	The Impact of Soldering Temperatures on No-clean Hand Soldering Processes	Oh, E. M.	WELA PUBLICATIONS LTD	1995

10	The Influence of Flux Residues on the Quality of Electronic Assemblies	Schmitt-Thomas, K. G.	WELA PUBLICATIONS LTD	1994

11	The Influence of Metal Plating of Chip Carriers on Reliability of SMT Solder Joints under Thermal Cycling	Huang, J. H.	WELA PUBLICATIONS LTD	1993

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