| 1 |
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Joining molybdenum to aluminium by diffusion bonding
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Bushby, R. S
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Chapman and Hall
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1996
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| 2 |
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Joining MoSi~2 to 316L stainless steel
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Conzone, S. D
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Chapman and Hall
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1997
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| 3 |
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Joining of carbon fibre-reinforced silicon nitride composites with 72Ag-26Cu-2Ti filler metal
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Nakamura, M
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Chapman and Hall
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1996
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| 4 |
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Joining of sialon ceramics by Sn-5 at % Ti based ternary active solders
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Xian, A.-P.
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Chapman and Hall
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1997
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| 5 |
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Joining of SiC ceramic to Ni-based superalloy with functionally gradient material fillers and a tungsten intermediate layer/
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Duan, H.; Li, S. Zhou, Y.; Zhang, Y. Qiu, J.;
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Chapman and Hall
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2003
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| 6 |
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Joining reaction-bonded silicon carbide using Inconel 600 superalloy/
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Xiao, P. Li, J. Zhu, G.;
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Chapman and Hall
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2003
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| 7 |
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Joining Ti-47Al-2Cr-2Nb with a Ti/(Cu,Ni)/Ti clad-laminated braze alloy/
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Guedes, A. Pinto, A. M.; Viana, F. Vieira, M. F.;
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Chapman and Hall
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2003
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| 8 |
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Joint strength and interfacial microstructure in silicon nitride/nickel-based Inconel 718 alloy bonding
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Lee, W.-C.
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Chapman and Hall
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1997
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| 9 |
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Journal of materials science
중앙도서관 대출불가(별치)
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Chapman and Hall
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1966-
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| 10 |
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Journal of materials science letters.
중앙도서관 대출불가(별치)
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Chapman and Hall
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1982-
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| 11 |
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Journal of materials science, Materials in electronics
중앙도서관 대출불가(별치)
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Chapman and Hall
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1990-
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| 12 |
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Journal of Materials Science: Materials in Electronics August 2001/
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Capper, Peter
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Chapman and Hall
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2001
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| 13 |
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Journal of materials science,Materials in medicine
중앙도서관 대출불가(별치)
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Chapman and Hall
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1990-
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| 14 |
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Journal of materials science [microform]
중앙도서관 대출불가(별치)
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Chapman and Hall
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1966-
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